What is PCB aluminum substrate?

1. Definition of aluminum substrate

　　The aluminum substrate is a common metal-based copper clad laminate, which consists of a circuit layer, a thermally conductive insulating layer and a metal bottom layer. The circuit layer (that is, copper foil) is generally etched to form a printed circuit, so that the various components of the component are connected to each other. In general, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, with a thickness of generally 35μm~ 280μm; the thermal insulation layer is the core technology of the aluminum substrate. It is generally composed of special polymers filled with special ceramics. It has small thermal resistance, excellent viscoelastic performance, and has the ability to resist thermal aging and can withstand mechanical and thermal stress.

Second, the characteristics of aluminum substrate

　　1. Adopt surface mount technology (SMT);

　　2. It is extremely useful to deal with heat diffusion in the circuit design scheme;

　　3. Reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product;

　　4. Reduce product volume, reduce hardware and assembly costs;

　　5. Replace the fragile ceramic substrate for better mechanical durability.

Third, the structure of the aluminum substrate

　　Aluminum-based copper clad laminate is a metal circuit board material, which consists of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:

　　Cireuitl.Layer circuit layer: equivalent to the copper clad laminate of ordinary PCB, the thickness of the circuit copper foil is loz to 10oz.

　　DielcctricLayer insulating layer: The insulating layer is a layer of thermally conductive insulating material with low thermal resistance. Thickness: 0.003" to 0.006" inches is the core technology of aluminum-based copper clad laminates.

　　BaseLayer bottom layer: It is a metal substrate, usually aluminum or optional copper. Aluminum base copper clad laminate and traditional epoxy glass cloth laminate, etc.

Fourth, the use of aluminum substrates

　　Application: Power Hybrid IC (HIC).

　　1. Audio equipment: input, output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.;

　　2. Power supply equipment: switching regulator, DC/AC converter, SW regulator, etc.;

　　3. Communication electronic equipment: high frequency amplifier, filter electrical appliance, sending circuit;

　　4. Office automation equipment: motor drives, etc.;

　　5. Car: electronic regulator, igniter, power controller, etc.;

　　6. Computer: CPU board, floppy disk drive, power supply device, etc.;

　　7. Power module: inverter, solid state relay, rectifier bridge, etc.