Analysis of the reasons for the roughness of the copper-plated surface of the PCB processing circuit board?

Analysis of the reasons for the roughness of the copper-plated surface of the PCB processing circuit board , the possible reasons are as follows:

The problem of PCB copper plating tank itself

1. Anode problem: Improper component content leads to impurities

2. The problem of glossing agent (decomposition, etc.)

3. Improper current density leads to uneven copper surface

4. The composition of the bath liquid is out of balance or impurity pollution

5. Improper equipment design or assembly leads to poor current distribution

Of course, as the PCB copper plating itself; the above problems are unlikely to cause rough pre-process problems

PTH process brings other impurities:

1. The activation component is out of balance and the concentration of palladium is too high or the residual plate of pre-soak salt

2. Speeding up the imbalance board and PCB copper plating is residual tin ions

3. The chemical copper is out of balance and the copper sinking is uneven

4. Improper pickling before PCB copper plating leads to residual impurities and black holes on the board. Process:

Micro-etching is not clean, resulting in carbon residue

Improper anti-oxidation leads to poor board surface

Poor drying leads to micro-etching, which cannot strip the carbon from the board, resulting in residual carbon

Improper current input and output lead to poor board surface,,,

Generally, the roughness of the board surface is caused by the copper plating itself of the PCB; the second is the introduction of pollution sources. The third is human error. In addition, if the material itself is not good (such as roughness: residual glue, etc.), it will also cause it.