1

Z-large imposition size

22" x 26"

550 x 650mm

2

Aperture

 0.1mm

Z small finished product aperture

0.004"

0.10mm

Finished hole tolerance

Immersion copper hole

±0.003"

±0.075mm

Non-sinking copper hole

±0.002"

±0.050mm

Lamination

±0.002"

±0.050mm

aspect ratio

9:1

9:1

3

laser hole

Micropore diameter

0.004" - 0.010"

0.10 - 0.15mm

aspect ratio

1 : 1

1 : 1

4

Z small line width line spacing

½oz / 18μm

0.003" / 0.003"

0.075 / 0.075mm

1oz / 35μm

0.006" / 0.006"

0.15 / 0.15mm

2oz / 70μm

0.008" / 0.008"

0.20 / 0.20mm

3oz / 105μm

0.010" / 0.010"

0.25 / 0.25mm

5

other

Solder mask

±0.003"

±0.075mm

Layer spacing

±0.0024"

±0.060mm

Hole copper distance (outer layer)

±0.003"

±0.075mm

Z pinhole copper pitch (inner layer)

2L - 8L

0.010"

0.25mm

10L - 22L

0.012"

0.30mm

6

shape

The distance from the edge of the board to the edge of the board

±0.004"

±0.100mm

The distance from the hole to the edge of the board

±0.004"

±0.100mm

Z small copper wire to board edge distance

outer layer

0.010"

0.25mm

inner layer

0.016"

0.40mm

7

Z large copper thickness

4oz

140μm

8

Z large plate thickness

0.189"

4.80 mm

9

Z small plate thickness

double sided

0.008"

0.20mm

4th floor

0.016"

0.40mm

6-20 floors

0.020"

0.60mm

10

Z pinhole copper thickness

0.004"

0.10mm

11

Z small solder mask thickness

0.004"

0.10mm

12

Impedance Control (Ohms)

±10%

±10%

13

layers

2~20 floors

14

plate

FR-4, international A-grade material, Sheng Gao TG substrate, Shengyi A-grade material, Kingboard A-grade material Rogers Taiyao TMM

15

surface treatment

Tin spray, lead-free spray tin, immersion tin, immersion gold, immersion gold+OSP, OSP, gold finger, selective immersion gold